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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6003 Issued Date : 1994.10.04 Revised Date : 2002.04.03 Page No. : 1/4
HJ2955
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HJ2955 is designed for general purpose of amplifier and switching applications.
Absolute Maximum Ratings (Ta=25C)
TO-252
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C)..................................................................................... 20 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage...................................................................................... -70 V BVCEO Collector to Emitter Voltage................................................................................... -60 V BVEBO Emitter to Base Voltage........................................................................................... -5 V IC Collector Current ........................................................................................................... -10 A IB Base Current .................................................................................................................... -6 A
Characteristics (Ta=25C)
Symbol BVCEO BVCBO BVEBO ICBO ICEX ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 fT Min. -60 -70 -5 20 5 2 Typ. Max. -20 -20 -50 -0.5 -1.1 -8 -1.8 100 Unit V V V uA uA uA mA V V V Test Conditions IC=-30mA, IB=0 IC=-1mA, IE=0 IE=-1mA, IC=0 VCB=-70V, IE=0 VCE=-70V, VEB(off)=-1.5V VCE=-30V, IB=0 VEB=-5V, IC=0 IC=-4A, IB=-400mA IC=-10A, IB=-3.3A IC=-4A, VCE=-4V IC=-4A, VCE=-4V IC=-10A, VCE=-4V VCE=-10V, IC=-500mA, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
MHz
HJ2955
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 hFE @ VCE=4V 10000 VCE(sat) @ IC=10IB
Spec. No. : HE6003 Issued Date : 1994.10.04 Revised Date : 2002.04.03 Page No. : 2/4
Saturation Voltage & Collector Current
125 C
o
Saturation Voltage (mV)
1000
75 C
o
hFE
100
25 C 75 C
o
o
100
125 C
o
25 C
o
10 10 100 1000 10000
10 10 100 1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
10000 VCE(sat) @ IC=3IB 10000
ON Voltage & Collector Current
VBE(ON) @ VCE=4V
Saturation Voltage (mV)
ON Voltage (mV)
1000
75 C 1000 25 C 125 C
o o
o
75 C 100 125 C
o o
o
25 C
10 10 100 1000 10000
100 10 100 1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Switching Time & Collector Current
10.00 VCC=30V, IC=10IB1= -10IB2
1000
Capacitance & Reverse-Biased Voltage
Switching Times (us).. .
1.00
Tstg
Capacitance (pF)
100 Cob
Ton 0.10 Tf
0.01 0.1 1.0 10.0
10 0.1 1 10 100
Collector Current (A)
Reverse-Biased Voltage (V)
HJ2955
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6003 Issued Date : 1994.10.04 Revised Date : 2002.04.03 Page No. : 3/4
Safe Operating Area
100000 PT=1ms
Collector Current-IC (mA)
10000 PT=100ms PT=1s 1000
100
10 1 10 100
Forward Voltage-VCE (V)
HJ2955
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
A C
Spec. No. : HE6003 Issued Date : 1994.10.04 Revised Date : 2002.04.03 Page No. : 4/4
Marking:
H J 2955 Date Code Control Code
B
D
L
F
G
Style: Pin 1.Base 2.Collector 3.Emitter
3 H E K 2 I 1 J
3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J *: Typical
DIM A B C D E F
Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283
Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80
DIM G H I J K L
Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630
Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ2955
HSMC Product Specification


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